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TE Connectivity (TE) . 2013266-7

TE Connectivity (TE) . 2013266-7

Attributes

Brand name, Manufacturer name, ManufacturerTE Connectivity (TE)
CategoryDIMM Sockets
CategoryL1Connectors
CategoryL2Card & Socket Connectors
CategoryL3Memory Sockets
moq, multiple, tierMinQty1, Number of Keys1
MPN, SKU2013266-7
qtyInStock0
DRAM TypeDouble Data Rate (DDR) 3
Connector SystemBoard-to-Board
Number of Positions240
PCB Mounting StyleThrough Hole
Module OrientationVertical
Row-to-Row Spacing : 1 9 mm [ 075 in1.9 mm [ .075 in ]
SealableNo
Connector & Contact Terminates ToPrinted Circuit Board
Center PostWithout
Product TypeSocket
Number of Bays, Number of Rows2
Keying, Ejector TypeStandard
Center Key, Module Key TypeOffset Left
DRAM Voltage1.5
Retention Post Location, Ejector LocationBoth Ends
Latch Color, Ejector Material ColorBlack
Latch Material, Ejector MaterialHigh Temperature Thermoplastic
Contact Base MaterialCopper Alloy
PCB Contact Termination Area Plating MaterialMatte Tin
Contact Underplating MaterialNickel
Contact Current Rating (Max).5
Socket TypeMemory Card
Socket StyleDIMM
Solder Tail Contact Plating Thickness : 2 54 ?m [ 100 ?in2.54 ?m [ 100 ?in ]
Contact Mating Area Plating Thickness : 76 ?m [ 30 ?in.76 ?m [ 30 ?in ]
Contact Mating Area Plating MaterialGold
Insertion StyleDirect Insert
Termination Post Length : 3 38 mm [ 133 in3.38 mm [ .133 in ]
PCB Mount Retention TypeSolder Tail (Pin)
PCB Mount Retention, Locating PostsWith

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SellerSKUMOQIn stockMultiplePrices
TE Connectivity2013266-711