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TE Connectivity (TE) . 1888669-1

TE Connectivity (TE) . 1888669-1

Attributes

Brand name, Manufacturer name, ManufacturerTE Connectivity (TE)
CategoryDIMM Sockets
CategoryL1Connectors
CategoryL2Card & Socket Connectors
CategoryL3Memory Sockets
moq, multiple, tierMinQty1, Number of Keys1
MPN, SKU1888669-1
qtyInStock0
DRAM TypeDouble Data Rate (DDR) 2 (Low Profile)
Connector SystemBoard-to-Board
Number of Positions240
PCB Mounting StyleThrough Hole
Module OrientationVertical
Row-to-Row Spacing : 1 9 mm [ 075 in1.9 mm [ .075 in ]
SealableNo
Connector & Contact Terminates ToPrinted Circuit Board
Center PostWithout
Product TypeSocket
Number of Bays, Number of Rows2
KeyingStandard
Center KeyCenter
DRAM Voltage1.8
Ejector TypeLocking
Retention Post Location, Ejector LocationBoth Ends
Latch Color, Ejector Material ColorNatural
Module Key TypeOffset Right
Latch Material, Ejector MaterialHigh Temperature Thermoplastic
Retention Post MaterialStainless Steel
Contact Base MaterialCopper Alloy
PCB Contact Termination Area Plating MaterialMatte Tin
Contact Underplating MaterialNickel
Contact Current Rating (Max).5
Socket TypeMemory Card
Socket StyleDIMM
Contact Mating Area Plating Thickness : 76 ?m [ 30 ?in.76 ?m [ 30 ?in ]
Solder Tail Contact Plating Thickness3
Contact Mating Area Plating MaterialGold
Insertion StyleDirect Insert
Termination Post Length : 2 87 mm [ 113 in2.87 mm [ .113 in ]
PCB Mount Retention TypeBoardlock
PCB Mount RetentionWith

Distributor offers

SellerSKUMOQIn stockMultiplePrices
TE Connectivity1888669-111