Attributes
. BGA . Names
Applicable IC
(16)
Application
(79)
Applications of solderi.
(1)
Case
(297)
Case/Package
(1)
Chip Type
(4)
Designed For
(8)
For Use With
(26)
Form Factor
(11)
Model / Series
(3)
Package / Case
(980)
Package Code
(43)
Package Cooled
(151)
Package Description
(11)
Package Type
(38)
Part Package Code
(14)
Rework Nozzle Type
(4)
Shop by Brand
(2)
Standard Package Name
(1)
Supplier Package
(1)
Termination Style
(4)
Type
(18)