Attributes

Key Value
Assembly Process Feature-40 ? 125??C?[?-40 ? 25.
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Positioning Bosses, .8?.
Circuit ApplicationYes
ConnectorPrinted Circuit Board
Connector HeightNatural
Connector Mounting TypeWithout
Connector SystemBoard-to-Board
Contact Base Material500
Contact Current Rating .Tab
Contact Layout2??m?[?78.74??in?]
Contact Mating Area Pla.Matte
Contact Mating Area Pla.Tin
Contact Mating Area Pla.Gold
Contact ShapeMatte
Contact Type.2??m?[?8??in?]
Dielectric Withstanding.2
High Temperature Compat..197, .354, .512, .669
Housing ColorTop
Housing Material.8?mm?[?.031?in?]
Insulation Resistance2
Locating Post LengthWith
Mating AlignmentInline
Mating Alignment TypeSurface Mount
Mating Entry Location.5?mm?[?.02?in?]
Number of Positions100
Number of Rows2
Operating Temperature R.5, 9, 13, 17
Operating Voltage100
Packaging MethodUL 94V-0
Packaging QuantitySignal
Packaging Reel Diameter10
PCB Connector Assembly .PCB Mount Header
PCB Contact Termination.Brass
PCB Contact Termination.Square
PCB Contact Termination..5
PCB Mount AlignmentPolarization
PCB Mount Alignment TypeBoard Mount
PCB Mount OrientationVertical
PCB Mount RetentionWith
SealableNo
Stack HeightMatte, 5?mm?[?.197?in?]
StackableYes
Termination Method to P.Inline
UL Flammability RatingNone
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