Attributes . Termination Method to Printed Circuit Board . Values

.25 ?m [&. (3)   .7 mm [&t. (2)   1.25, 9.5 (12)   1.27 ?m [. (5)   1.47 mm [. (3)   120 (4)   150 ? 300 (4)   2.21 mm [. (1)   2.29 mm [. (2)   2.5 mm [&. (3)   2.54 mm [. (4)   2.6 mm [&. (5)   2.72 mm [. (1)   2.77 mm [. (2)   2.79 mm [. (8)   2.8 mm [&. (2)   3.05 mm [. (7)   3.1 mm [&. (1)   3.18 mm [. (3)   3.2 mm [&. (15)   3.2 mm [&. (1)   3.3 mm [&. (6)   3.5 mm [&. (3)   3.56 mm [. (1)   3.56 mm [. (1)   3.6 mm [&. (1)   3.7 mm [&. (3)   3.81 ? 6.35 ?m&t. (2)   4.95 mm [. (3)   5.8 mm [&. (1)   50 ? 100 (1)   6.7 mm [&. (2)   8.26 mm [. (1)   Closed Entry Housing (4)   Crimp, Insulation Displ. (1)   Hybrid Surface Mount (21)   Inline (10)   matrix (2)   Reflow Solder (2)   Single Sided (1)   SMD Soldering (20)   Solder (17)   Staggered (1)   Staggered Type A (2)   Straddle Mount (2)   Surface Mount (117)   Surface Mount - Solder . (2)   Surface Mount, Through . (1)   Through Hole (138)   Through Hole - Press-Fit (186)   Through Hole - Press-Fi. (5)   Through Hole - Solder (577)   Tin (10)   Wave solder (1)