Attributes

Key Value
Approved StandardsUL E28476
Boardlock MaterialCopper Alloy
Boardlock Plating Mater.Tin-Lead over Nickel
Bracket MaterialZinc
Bracket Plating MaterialNickel over Copper
Centerline (Pitch)1.27?mm?[?.05?in?]
Circuit ApplicationSignal
ConnectorPrinted Circuit Board
Connector Mounting TypeBoard Mount
Connector StyleReceptacle
Connector SystemCable-to-Board
Connector TypeConnector Assembly
Contact Base MaterialPhosphor Bronze
Contact Current Rating .1
Contact Mating Area Pla.Gold Flash over Palladi.
Contact Mating Area Pla.30
Housing ColorBlack
Housing MaterialThermoplastic
Mating AlignmentWithout
Mating Connector LockWithout
Mating RetentionWithout
Mounting Hole Diameter.109
Number of Positions68
Number of Rows2
Operating Temperature R.-55 ? 105??C?[?-67 ? 22.
Packaging MethodTube
Packaging Quantity8
PCB Contact Termination.Tin-Lead
PCB Mount AlignmentWithout
PCB Mount OrientationRight Angle
PCB Mount RetentionWith
PCB Mount Retention TypeBoardlock
PCB Mounting StyleThrough Hole - Solder
PCB Thickness (Recommen.1.57?mm?[?.062?in?]
Post Plating MaterialTin-Lead over Nickel
Post Size.034
Product TypeConnector
ProfileStandard
Row-to-Row Spacing.1 in, 2.54 mm
SealableNo
Shell MaterialCarbon Steel
Shell Plating FinishBright
Shell Plating MaterialNickel over Copper
Shell TypeFull Metal Shell
ShieldedYes
Termination Method to P.Through Hole - Solder
Termination Post Length2.54?mm?[?.1?in?]
UL Flammability RatingUL 94V-0
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