Attributes

Key Value
Assembly Process FeatureNone
BossNo
Centerline (Pitch)&thin.1.27?mm?[?.05?in?]
Connector & Contact Ter.Printed Circuit Board
Contact Base MaterialBeryllium Copper
Contact LayoutStaggered
Contact Mating Area Pla.Gold
Contact Mating Area Pla.50
Contact TypeSocket
Height?:</span> .5.46?mm?[?.215?in?]
Housing ColorGray
Housing MaterialLCP (Liquid Crystal Pol.
HybridNo
Mating AlignmentWith
Mating Alignment TypePolarization
Number of Positions128
Number of Rows2
Packaging MethodPackage
Packaging Quantity6
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Gold Flash
PCB Mount OrientationVertical
PCB Mount RetentionWithout
Pick and Place CoverWithout
Post Size?:</spa..20 x .46?mm?[?.008 x ..
Post StylesPosted
Product TypeConnector
Row-to-Row Spacing&thin.3.81?mm?[?.15?in?]
SealableNo
StabilizersWithout
StackableNo
Tail Length?:</s.7.62?mm?[?.3?in?]
Termination Method to P.Through Hole
Termination Post Length.7.62?mm?[?.3?in?]
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