Attributes

Key Value
Assembly Process Feature4?mm?[?.157?in?]
Board-to-Board Configur.Mezzanine
Centerline (Pitch).5?mm?[?.0197?in?], With
ConnectorPrinted Circuit Board
Connector Height.5?mm?[?.0197?in?]
Connector SystemBoard-to-Board
Contact Base Material200
Contact Current Rating .Socket
Contact Layout1.9685, 39.37
Contact Mating Area Pla.Gold, Tin
Contact Mating Area Pla.Gold
Contact Type7.874
Dielectric Withstanding.2
Ground Component TypeGrounding Contact
High Temperature Compat.4?mm?[?.157?in?]
Housing ColorWith
Housing MaterialLocating Posts
Insulation Resistance2
Mating AlignmentInline
Mating Alignment TypeSurface Mount
Mating Post Length1.9685, 39.37
Number of Positions220
Number of Rows2
Operating Temperature R.High Temperature Thermo.
Operating Voltage50
Packaging MethodPick and Place Cover
Packaging QuantityYes
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Copper Alloy
PCB Contact Termination..05, 1, .5
PCB Mount AlignmentWith
PCB Mount Alignment TypePolarized
PCB Mount OrientationVertical
PCB Mount RetentionSolder Peg
PCB Mount Retention TypeInline
Stack HeightBlack
StackableYes
Termination Method to P.1, 1.3
UL Flammability Rating-40 ? 85??C?[?-40 ? 185.
© 2025 · Data Alchemy · Version 60 · ts:1760052239
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