Attributes

Key Value
Assembly Process FeatureNone
Centerline (Pitch)1.27?mm?[?.05?in?]
CommentAlso see 1-530745-1 uns.
ConnectorPrinted Circuit Board
Connector Height5.46?mm?[?.215?in?]
Contact Base MaterialBeryllium Copper
Contact LayoutStaggered
Contact Mating Area Pla.Gold
Contact Mating Area Pla.50
Contact TypeSocket
Housing ColorGray
Housing MaterialLCP (Liquid Crystal Pol.
Mating AlignmentWith
Mating Alignment TypePolarized
Number of Positions128
Number of Rows2
Packaging MethodPackage
Packaging Quantity2
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Tin-Lead
PCB Mount OrientationVertical
PCB Mount RetentionWithout
Post Size.20 x .46?mm?[?.008 x ..
Row-to-Row Spacing3.81?mm?[?.15?in?]
SealableYes
StackableNo
Termination Method to P.Through Hole - Solder
Termination Post3.56, 4.83, .14, .19
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