Attributes

Key Value
Assembly Process Feature-65 ? 125??C?[?-85 ? 25.
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Locating Posts, .8?mm?[.
Circuit ApplicationNone
CommentBox & Tray, Tray
ConnectorPrinted Circuit Board
Connector Contact Load .Fully Loaded
Connector HeightLCP (Liquid Crystal Pol.
Connector Mounting TypeWith
Connector SystemBoard-to-Board
Contact Base Material675
Contact Current Rating .Pin
Contact Mating Area Pla.Single Beam, Square
Contact Mating Area Pla.Select Gold
Contact ShapeGold
Contact Type.25??m?[?9.8425??in?]
Dielectric Withstanding.2
Header TypeStandard
Housing Color.8?mm?[?.031?in?]
Housing MaterialBlack
Impedance100
Insulation Resistance2
Mating AlignmentWith
Mating RetentionSurface Mount
Number of Positions120
Number of Rows2
Operating Temperature R..06?mm?[?.25?in?]
Operating Voltage125
Packaging Method24
Packaging QuantityUL 94V-0
PCB Connector Assembly .PCB Mount Header
PCB Contact Termination.Phosphor Bronze
PCB Contact Termination.1.25, 9.5
PCB Mount AlignmentWith
PCB Mount Alignment TypeBoard Mount
PCB Mount OrientationVertical
PCB Mount RetentionWithout
PCB Thickness (Recommen.30?mm?[?1.181?in?]
Row-to-Row Spacing29.24?mm?[?1.149132?in?]
SealableNo
Stack Height4.73?mm?[?.185889?in?]
StackableNo
Termination Method to P..25??m?[?9.8425??in?]
UL Flammability RatingPower & Signal
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