Attributes

Key Value
Assembly Process Feature-65 ? 125??C?[?-85 ? 25.
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Locating Posts, .8?mm?[.
Circuit ApplicationNone
CommentBox & Tray, Tray
ConnectorPrinted Circuit Board
Connector Contact Load .Fully Loaded
Connector HeightLCP (Liquid Crystal Pol.
Connector Mounting TypeWith
Connector SystemBoard-to-Board
Contact Base Material675
Contact Current Rating .Pin
Contact Mating Area Pla.Single Beam, Square
Contact Mating Area Pla.Select Gold Flash
Contact ShapeGold
Contact Type.12??m?[?5??in?]
Dielectric Withstanding.2
Header TypeStandard
Housing Color.8?mm?[?.031?in?]
Housing MaterialBlack
Impedance100
Insulation Resistance2
Mating AlignmentWith
Mating RetentionSurface Mount
Number of Positions80
Number of Rows2
Operating Temperature R..05?mm?[?.12?in?]
Operating Voltage125
Packaging Method40
Packaging QuantityUL 94V-0
PCB Connector Assembly .PCB Mount Header
PCB Contact Termination.Phosphor Bronze
PCB Mount AlignmentWith
PCB Mount Alignment TypeBoard Mount
PCB Mount OrientationVertical
PCB Mount RetentionWithout
PCB Thickness (Recommen.16?mm?[?.63?in?]
Row-to-Row Spacing15.37?mm?[?.6043?in?]
SealableNo
Stack Height4.02?mm?[?.158?in?]
StackableNo
Termination Method to P.1.25, 9.5
UL Flammability RatingPower & Signal
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