Attributes

Key Value
Assembly Process FeatureNone
Board-to-Board Configur.Mezzanine
Centerline (Pitch).64?mm?[?.025?in?]
Circuit ApplicationSignal
ConnectorPrinted Circuit Board
Connector Height17.7546?mm?[?.699?in?]
Connector Mounting TypeBoard Mount
Connector SystemBoard-to-Board
Connector Width8.128?mm?[?.32?in?]
Contact Base MaterialCopper Alloy
Contact Current Rating .11.5
Contact Mating Area Pla.Gold or Palladium Nicke.
Contact Mating Area Pla..76??m?[?30??in?]
Contact ShapeDual Beam
Contact TypePin
Data Rate10
Ground Component TypeGround Bus
Header TypeHeader Only
Housing ColorBlack
Housing MaterialLCP (Liquid Crystal Pol.
Impedance50
Mating AlignmentWithout
Mating RetentionWith
Number of Columns133
Number of Positions266
Number of Power Positio.7
Number of Rows2
Number of Signal Positi.266
Operating Temperature R.-55 ? 125??C?[?-67 ? 25.
Operating Voltage7
Packaging MethodBox & Tube, Tube
Packaging Quantity5
PCB Connector Assembly .PCB Mount Header
PCB Contact Termination.Tin-Lead
PCB Mount AlignmentWith
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Mount Retention TypeBoardlock
PCB Thickness (Recommen.1.57?mm?[?.8?in?]
Row-to-Row Spacing5.79?mm?[?.227547?in?]
SealableNo
Stack Height17.96, 27, 1.062
StackableYes
Termination Method to P.Hybrid Surface Mount
UL Flammability RatingUL 94V-0
© 2025 · Data Alchemy · Version 60 · ts:1760052239
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