Attributes

Key Value
Assembly Process Feature-40 ? 125??C?[?-40 ? 25.
Assembly Process Featur.500
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Positioning Bosses, .8?.
Circuit ApplicationYes
ConnectorPrinted Circuit Board
Connector HeightNatural
Connector Mounting TypeWithout
Connector SystemBoard-to-Board
Contact Base MaterialSteel
Contact Current Rating .Socket
Contact Layout2??m?[?78.74??in?]
Contact Mating Area Pla.Matte
Contact Mating Area Pla.Tin
Contact Mating Area Pla.Gold
Contact ShapeMatte
Contact Type.2??m?[?8??in?]
Dielectric Withstanding.2
High Temperature Compat..197, .236, .276, .315
Housing ColorTop
Housing Material.8?mm?[?.031?in?]
Insulation Resistance2
Locating Post LengthWith
Mating AlignmentInline
Mating Alignment TypeSurface Mount
Mating Entry Location.5?mm?[?.02?in?]
Number of Positions80
Number of Rows2
Operating Temperature R.5, 6, 7, 8
Operating Voltage100
Packaging MethodUL 94V-0
Packaging QuantitySignal
Packaging Reel Diameter1000
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Copper Alloy
PCB Contact Termination.Square
PCB Contact Termination..5
PCB Mount AlignmentPolarization
PCB Mount Alignment TypeBoard Mount
PCB Mount OrientationVertical
PCB Mount RetentionWith
SealableNo
Stack HeightMatte, 5?mm?[?.197?in?]
StackableYes
Termination Method to P.Inline
UL Flammability RatingPick and Place Cover
© 2025 · Data Alchemy · Version 60 · ts:1760052239
prev