Attributes

Key Value
Assembly Process FeatureNone
Centerline (Pitch)1.27?mm?[?.05?in?]
ConnectorPrinted Circuit Board
Connector Height5.46?mm?[?.215?in?]
Contact Base MaterialBeryllium Copper
Contact Mating Area Pla.Gold
Contact Mating Area Pla.50
Contact TypeSocket
Housing ColorGray
Housing MaterialLCP (Liquid Crystal Pol.
Mating AlignmentWith
Mating Alignment TypePolarized
Number of Positions20
Number of Rows2
Packaging MethodPackage
Packaging Quantity6
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Tin-Lead
PCB Mount OrientationVertical
PCB Mount RetentionWithout
Row-to-Row Spacing3.81?mm?[?.15?in?]
SealableNo
StackableNo
Termination Method to P.Through Hole - Solder
Termination Post3.56, 4.83, .14, .19
© 2025 · Data Alchemy · Version 60 · ts:1760052239
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