Attributes

Key Value
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Top, Post Polarization,.
Circuit Application.06?mm?[?.8?in?]
ConnectorPrinted Circuit Board
Connector HeightBlack
Connector Mounting TypeWith
Connector SystemBoard-to-Board
Contact Base Material16
Contact Current Rating .Socket
Contact Layout.5 ? 2.54??m?[?19.685 ?.
Contact Mating Area Pla.Matte
Contact Mating Area Pla.Gold
Contact Type.076??m?[?3??in?]
Data Rate750
Dielectric Withstanding.1000
Housing Color1.52, 3.04, 6.09
Housing Material.06, .12, .24
Impedance100
Insulation Resistance1000
Mating AlignmentThrough Hole - Press-Fit
Mating Entry LocationBoard Mount
Mating Retention1.47?mm?[?.057?in?]
Number of Loaded Positi.393
Number of Pairs96
Number of Positions84, 96, 393
Number of Power Positio.0
Number of Signal Positi.8
Operating Temperature R.4.49?mm?[?.176?in?]
Operating Voltage0, 250
Packaging MethodUL 94V-0
Packaging QuantityBoard Standoff
Pairs per Column8
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Copper Alloy
PCB Contact Termination.Tin
PCB Contact Termination.1.5
PCB Mount AlignmentWith
PCB Mount Alignment TypeWith
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Thickness (Recommen.LCP (High Temp Thermopl.
SealableNo
Solder Process Feature-55 ? 85??C?[?-67 ? 185.
StackableNo
Termination Method to P.Staggered
Termination PostStaggered
UL Flammability RatingPower & Signal
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