Attributes

Key Value
Assembly Process FeatureNone
Board-to-Board Configur.Mezzanine
Centerline (Pitch).64?mm?[?.025?in?]
Circuit ApplicationSignal
ConnectorPrinted Circuit Board
Connector Height15.0114?mm?[?.591?in?]
Connector Mounting TypeBoard Mount
Connector SystemBoard-to-Board
Connector Width8?mm?[?.315?in?]
Contact Base MaterialCopper Alloy
Contact ConfigurationDual Beam
Contact Current Rating .11.5
Contact Mating Area Pla.Gold or Palladium Nicke.
Contact Mating Area Pla..76??m?[?30??in?]
Contact TypeSocket
Data Rate10
Ground Component TypeGround Bus
Header TypeHeader Only
Housing ColorBlack
Housing MaterialLiquid Crystal Polymer
Impedance50
Mating AlignmentWithout
Mating RetentionWith
Number of Columns76
Number of Positions152
Number of Power Positio.4
Number of Rows2
Number of Signal Positi.152
Operating Temperature R.-55 ? 125??C?[?-67 ? 25.
Operating Voltage4
Packaging MethodBox & Tube, Tube
Packaging Quantity8
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Tin-Lead
PCB Mount AlignmentWith
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Thickness (Recommen.1.57?mm?[?.8?in?]
Row-to-Row Spacing5.79?mm?[?.227547?in?]
SealableNo
Stack Height15.62, 18, 20, 21.6, 27.
StackableNo
Termination Method to P.Hybrid Surface Mount
UL Flammability RatingUL 94V-0
© 2025 · Data Alchemy · Version 60 · ts:1760052239
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