Attributes

Key Value
Assembly Process FeaturePick and Place Cover
Board-to-Board Configur.Mezzanine
Centerline (Pitch)1.3?mm?[?.051?in?]
Circuit ApplicationPower & Signal
ConnectorPrinted Circuit Board
Connector Mounting TypeBoard Mount
Connector SystemBoard-to-Board
Contact Current Rating .1
Contact Mating Area Pla.Gold
Contact Mating Area Pla..76??m?[?30??in?]
Contact TypeTab
Header TypePin Header
Housing ColorNatural
Housing MaterialThermoplastic
Mating AlignmentWithout
Mating RetentionWith
Number of Positions120
Operating Temperature R.0 ? 100??C?[?32 ? 212??.
Packaging MethodPackage
PCB Connector Assembly .PCB Mount Header
PCB Mount AlignmentWithout
PCB Mount OrientationVertical
PCB Mount RetentionWithout
PCB Thickness (Recommen.1.57?mm?[?.8?in?]
Row-to-Row Spacing2?mm?[?.0786?in?]
SealableNo
Stack Height1.063
Termination Method to P.Surface Mount - Solder .
UL Flammability RatingUL 94V-0
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