Attributes

Key Value
Assembly Process FeatureVacuum Tape
Centerline (Pitch)1.27?mm?[?.05?in?]
Circuit ApplicationSignal
ConnectorPrinted Circuit Board, .
Connector Height6.1?mm?[?.24?in?]
Connector ProfileStandard
Connector SystemBoard-to-Board
Contact Base MaterialPhosphor Bronze
Contact Current Rating .1.5
Contact Mating Area Pla.Tin
Contact Mating Area Pla.3 ? 5??m?[?118.11 ? 196.
Contact TypeSocket
Contact Underplating Ma.Nickel
Header TypeShrouded
Housing ColorRed
Housing MaterialPA 4.6
Mating AlignmentWith
Mating Alignment TypePolarization
Mating Entry LocationBottom
Mating RetentionWithout
Number of Positions20
Operating Temperature R.-40 ? 105
Operating Voltage100
Packaging MethodReel
Packaging Quantity1200
Panel Mount FeatureWithout
PCB Contact Termination.Tin
PCB Mount AlignmentWithout
PCB Mount OrientationVertical
PCB Mount RetentionWithout
Row-to-Row Spacing1.5
Termination Method to P.Surface Mount
UL Flammability RatingUL 94V-0
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