Attributes

Key Value
Assembly Process Feature0 ? 100??C?[?32 ? 212??.
Board-to-Board Configur.Mezzanine
Centerline (Pitch)Board Mount, 1.3?mm?[?..
Circuit ApplicationNone
ConnectorPrinted Circuit Board
Connector HeightThermoplastic
Connector Mounting TypeWithout
Connector SystemBoard-to-Board
Contact Base Material500
Contact Current Rating .Socket
Contact Layout1
Contact Mating Area Pla.Dual Beam, Single Beam
Contact Mating Area Pla.Gold
Contact ShapeTin-Lead
Contact Type.76??m?[?29.9212??in?]
Dielectric Withstanding.18
Housing Color1.3?mm?[?.051?in?]
Housing MaterialNatural
Insulation Resistance18
Mating AlignmentWith
Mating RetentionSurface Mount - Solder .
Number of Positions296
Number of Rows18
Operating Temperature R.1.57?mm?[?.8?in?]
Operating Voltage48
Packaging Method20
Packaging QuantityUL 94V-0
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Copper Alloy
PCB Mount AlignmentWithout
PCB Mount OrientationVertical
PCB Mount RetentionWithout
PCB Thickness (Recommen.1.181
Row-to-Row Spacing10.65?mm?[?.418545?in?]
SealableNo
Stack Height2?mm?[?.0786?in?], 15, .
StackableYes
Termination Method to P.Matrix
UL Flammability RatingPower & Signal
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