mpn
HSB09-212115
brand
name: CUI Devices
manufacturer
name: CUI Devices
Attributes
Key
Value
Attachment Method
Adhesive
Category
Fans, Thermal Management
Diameter
-
Fin Height
0.591" (15.00mm)
Length
0.827" (21.00mm)
Material
Aluminum Alloy
Material Finish
Black Anodized
Mfr
CUI Devices
Package
Box
Package Cooled
BGA
Power Dissipation @ Tem.
4.3W @ 75?C
Product Status
Active
Series
HSB
Shape
Square, Pin Fins
Thermal Resistance @ Fo.
6.00?C/W @ 200 LFM
Thermal Resistance @ Na.
17.39?C/W
Type
Top Mount
Width
0.827" (21.00mm)