Attributes

Key Value
Board-to-Board Configur.Mezzanine
BossYes
Busbar Mating Area Plat.200
Centerline (Pitch)&thin..6?mm?[?.024?in?]
Connector & Contact Ter.Printed Circuit Board
Connector SystemBoard-to-Board
Contact Base MaterialCopper Alloy
Contact Current Rating ..5
Contact LayoutInline
Contact Mating Area Pla.Gold
Contact Mating Area Pla..2??m?[?7.874??in?]
Contact Plating Thickne.0.05?0.127, 1.3
Contact TypeSocket
Dielectric Withstanding.200
Height?:</span> .4?mm?[?.157?in?]
Housing MaterialHigh Temperature Thermo.
Insulation Resistance2
Mating AlignmentWith
Mating Alignment TypePolarization
Number of Positions140
Number of Rows2
Operating Temperature R.-40 ? 85??C?[?-40 ? 185.
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Gold
PCB Contact Termination..05??m?[?1.9685??in?]
PCB Mount AlignmentWith
PCB Mount Alignment TypeLocating Posts
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Mount Retention TypeSolder Peg
PCB Thickness (Recommen..2
Product TypeConnector
SeriesFree Height
Stack Height?:</.4?mm?[?.157?in?]
StackableYes
Termination Method to P.Surface Mount
Voltage50
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