Attributes . Technology . Values
Coax; VGA/SVGA (1) Cold Applied (42) Cold Applied De-energis. (2) Cold Applied Energised . (4) Cold Applied, Cold Shri. (10) Cold Shrink (2) Compact Fluorescent (35) Completely sealed and s. (1) Compression (66) Contact (7) CoolMOS? (18) CoolMOS? C6 (5) CoolMOS? CE (2) CoolMOS? CFD7 (1) CoolMOS? E6 (1) CoolMOS? P7 (4) CoolSiC? 3G, (1) CoolSiC? 5G, (1) CoolSiC?+ (2) Crimp (22) Data Acquisition (2) Development Kit (3) DIAMOND Seal (1) Digimatic (14) Digital (3) Direct Thermal (15) Direct Thermal, Thermal. (10) DMOS (12) Dot Matrix (18) Double shielded (10) DRAM (15) DRAM - EDO (1) DRAM - FP (1) Dye sublimation (1) Dye sublimation/thermal. (2) EconoPACK? 3 (1) EconoPACK?4 (1) EcoRight/ComfortZone (1) EcoRight/ComfortZone/Wa. (2) EcoRight/QuickClean/Com. (1) EDP (4) EEPROM (473) EEPROM, SRAM (6) EETMOS3 (2) EETMOS4 (2) EiceDRIVER? (2) Elastomer Buffer (1) Electrolytic (38) Electromechanical (8) Electromechanical/Magne. (9) Energy Metering IC (1) Epoxy/Curing Oven (2) EPROM - OTP (8) EPROM - UV (2) Ethernet (4) EVA (2) External Switch (3) FERD (Field Effect Rect. (4) FET (2) Fiber Optic (75) Fiber-Gripping (2) Field Stop (7) FLASH (104) FLASH - Boot Block (2) FLASH - NAND (69) FLASH - NAND (MLC) (6) FLASH - NAND (pSLC) (1) FLASH - NAND (SLC) (10) FLASH - NAND (SLC), FLA. (5) FLASH - NAND (TLC) (11) FLASH - NAND, Mobile LP. (6) FLASH - NOR (312) FLASH - NOR (MLC) (1) FLASH - NOR (SLC) (6) Fluorescent (15) Foiled unshielded twist. (1) FPGA (1) FRAM (Ferroelectric RAM) (26) FRED (9) FREDFET, (2) FTSC (5) Full Range (1) Fused Deposition Modeli. (2) GaAs (3) GaAsP on GaP (8) GaN (1) GaN HEMT (1) GaNFET (Cascode Gallium. (2) GaP (6) Gas Discharge Tube (2) GDDR5 SDRAM (42) GDDR5X SDRAM (12) GDDR6 SDRAM (59) GDDR6X SDRAM (1) GDT, MOV (3) General Purpose (11) GenX3?, (6) GMR (Giant Magnetoresis. (20) Gold Bi-Metal (1) Hall Effect (279)